Symposium on Cleaning of Electronic Device Components and Materials, ASTM Special Technical Publication No. 246

Symposium on Cleaning of Electronic Device Components and Materials, ASTM Special Technical Publication No. 246

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Symposium on Cleaning of Electronic Device Components and Materials, ASTM Special Technical Publication No. 246

Symposium on Cleaning of Electronic Device Components and Materials, ASTM Special Technical Publication No. 246

$20.00
Sale price  $20.00 Regular price 

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Symposium on Cleaning of Electronic Device Components and Materials
1958

This volume is a collection of technical papers presented under ASTM (American Society for Testing and Materials), focusing on the cleaning processes required for electronic components and materials. It reflects the increasing precision demands of the electronics industry during the late 1950s, particularly with the growth of semiconductor and high-reliability systems.

The book emphasizes the importance of surface cleanliness in ensuring the proper performance, reliability, and longevity of electronic devices. Even microscopic contaminants—such as oils, dust, flux residues, and chemical films—can significantly affect electrical behavior and component integrity.

Key areas covered include:

Contamination sources: manufacturing residues, environmental particles, and handling-related impurities
Cleaning methods: solvent cleaning, vapor degreasing, ultrasonic cleaning, and chemical treatments
Material compatibility: ensuring cleaning processes do not damage sensitive materials like metals, ceramics, and early semiconductor substrates
Evaluation techniques: methods for detecting and measuring surface contamination, including visual inspection and chemical analysis
Process control: maintaining consistent cleanliness standards in production environments

The volume also discusses the challenges of balancing effective cleaning with the need to avoid corrosion, residue formation, or material degradation. Contributors highlight the relationship between cleaning quality and device reliability, particularly in military and aerospace applications where failure rates must be minimized.

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